KoCoS Blog

Quality assurance by geometric measurements increasingly becomes important not only in the final inspection. The control of dimensional accuracy is progressively shifting to the beginning of the manufacturing processes in order to detect and minimize rejects at an early stage.
The 3D measuring systems LOTOS are suitable among other applications for the exact measurement of ingots, which represent the beginning of the production process of semiconductor wafers. In order to obtain the optimum yield of wafers from the ingots, a highly accurate geometry determination at the beginning of the manufacturing process is more important than ever.

High-precision measurements of the ingot are critical to the quality and productivity of the wafer cutting process. Only an exact geometry allows to set perfect cuttings.

A solution using mechanical measurements is possible, but very susceptible. The material is very brittle, so mechanical impacts can easily cause micro cracks invisible to the human eye. These lead to wafer breakage in later process steps and thus to cost-intensive rejects.

The advantages of geometry inspection of ingots with LOTOS 3D measuring systems are:

  1. Less waste and scrap of the expensive materials
  2. Optimal utilization of the cross-sectional area of the ingot increases productivity
  3. Contactless measuring method allows a solution without mechanical stress of the material, micro cracks due to mechanical stress are therefore excluded

The following video shows the measurement of an ingot with LOTOS
cloud.kocos.com/index.php/s/dmXzPjWoBBRZJH6

As well as the scan result as 3D visualization
cloud.kocos.com/index.php/s/d3PiSii2FywWwLT

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